Policy researcher @ RAND's Center on AI, Security, and Technology (CAST). Working on semi supply chains, U.S.-China relations, and AI governance.
Washington, D.C.
Joined May 2019
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Last week, SK Hynix pulled off the largest U.S. listing by a foreign company in history (at $26.5 billion, topping Alibaba's 2014 record). This week, China's CXMT is set to go public on Shanghai’s STAR Market.
The back-to-back memory IPOs reflect surging demand for commodity DRAM and HBM, the stacked memory technology found in nearly every leading AI chip.
Who makes HBM, why is it so hard to manufacture, and how far behind is CXMT? My RAND colleagues and I published a primer on all of the above.
Thread below with takeaways from the paper.
There are plans to produce some parts of the HBM supply chain in the United States, but the ecosystem remains heavily concentrated in East Asia. 78% of HBM-TSV capacity currently sits in South Korea.
You can read the full primer here! rand.org/content/dam/rand/pu… Thanks to my co-authors @KonstantinPilz @ohlennart and reviewers @vikramskr @JSMondschein
Jack retweeted
“The name of the company is Meta. It's a cutting edge high-tech Web 3.0 company with no data and consumer exploitation issues whatsoever currently trading at a deep discount to fair value”
