SinceVision

Inspecting large automotive PCB connectors forces a tradeoff between field width and depth of field. Our SR7050 3D laser profiler resolves this with a 30.5mm beam width and 5mm depth of field, delivering 0.018mm repeatability for 0.04mm accuracy. 👇 sincevision.com/news/industr…

October 2026 was a pivotal month for the our team. 👉 Read the full articles: sincevision.com/news/press-c… We break down the technical specifications and core applications of our newest releases: 1️⃣ SRI6000 Series (SRI6480): Our first embedded vision 3D laser profiler.

NEW PRODUCT: Introducing the SinceVision SGI-N030W Laser Displacement Sensor Engineered for battery electrode thickness & semiconductor inspection, the SGI-N030W features a wide light spot and 50kHz sampling speed Read the full press release: sincevision.com/news/press-c…

Inspect AI server connectors and wiring harnesses with 3D laser profilers.

How 3D Laser Profilers Inspect High-Speed Connectors, Memory Sockets, and Cable Harnesses Inline? Swipe through the 5 slides below to see problems faced by AI Server manufacturers. Read how our SRI Series 3D laser profiler solves these problems: sincevision.com/news/industr…

Accelerating Smart Manufacturing in Vietnam: Meet SinceVision at VIMF Bắc Ninh 2026 Join @SinceVision at VIMF2026 (Nov 4–6) for live demos of our 3D laser profilers operating at speeds up to 67,000 Hz. 📍 Kinh Bac Cultural Center Read more here: sincevision.com/news/event-e…

High-Speed Cameras at PhotoMechanics Conference 2026 - Booth 2 We are live at Booth 2 and demonstrating advanced high speed imaging systems for material testing. 📍 Location: Ecole Nationale Supérieure d Arts et Métiers 👉 Stop by to discuss your specific laboratory setups

Watch the SinceVision high-speed camera capture an SHPB test at 1280x456 and 30,000 FPS, isolating every deformation and fracture point. See our imaging systems live in Paris! 👇 📍 PhotoMechanics 2026 🎪 Booth 2

3️⃣ VIMF 2026 (Vietnam): Live intelligent quality control automation on consumer electronics and semiconductor. sincevision.com/news/event-e…

2️⃣ ICECM / iDICs 2026 (Ho Chi Minh City): Integrating uncompromised high-speed imaging into complex Digital Image Correlation (DIC) workflows. sincevision.com/news/event-e…

1️⃣ PhotoMechanics 2026 (Paris): Live crack propagation and Hopkinson Bar impact testing using the SH6 (1,150,000 fps) and SH8 (30,000 fps) high-speed cameras. sincevision.com/news/event-e…