Synopsys

AI is evolving from assisting engineers to executing complete workflows.   Meet Synopsys AgentEngineer solutions, a portfolio of long-horizon super agents that can reason through complex engineering objectives, orchestrate specialized task agents, and adapt along the way: bit.ly/47pJe5D

How do you keep scaling AI infrastructure when energy can’t scale at the same pace? Learn how full-stack co-design, data-movement optimization, and AI-driven engineering are helping the industry get more intelligence out of every watt: bit.ly/4iQHt6X

High-performance computing demands ever-increasing design efficiency. Learn how @HPE's Slingshot team is using Synopsys tools to accelerate chip development while maintaining quality and schedule goals. bit.ly/4e0rjGs

Physical AI is transforming intelligence from something that lives in software to something that operates in the real world.  Experts from @Arm, @NVIDIA, @SchaefflerGroup, and Synopsys discussed how simulation, digital twins, robotics, and AI are converging to create intelligent systems that can perceive, decide, and act safely in physical environments.  Watch now: bit.ly/4yRi82D

For decades, the HPC industry designed around the server. In AI factories, the rack is the new design unit. Read Part 1 of our Architecting AI Factories blog series: bit.ly/4BuhiLI

AI is asking more of chips and raising new questions about how they're developed.  Synopsys President & CEO @SassineGhazi talks AI agents, autonomous engineering, and more with @SemiEngineering’s @Chip_Insider: semiengineering.com/how-clos…

Multi-die architectures, 3D integration, and co-packaged optics are driving the need for early multi-physics analysis, deeper ecosystem collaboration, and AI-enabled design workflows.  Experts from @AMD, @Broadcom, TSMC and Synopsys discussed this and more. Watch on demand now: bit.ly/3ULc0uC

Agentic systems can run the loop, but the objectives, parameters, and oversight remain uniquely human. That's orchestration, and it's becoming core engineering work. Read the final part of our agentic AI blog series: bit.ly/4esXTRl

We’re at #NVIDIAGTC Berlin showcasing our latest work with @nvidia, from GPU-accelerated engineering to physical AI. See how we’re helping customers accelerate design and simulation across silicon and systems: bit.ly/3UF0uAX

Most AI accelerator teams pull IP from several vendors and hope it all works together. That's usually where the schedule slips. We give you every layer of silicon IP the AI/HPC chip needs, from interconnect and memory to foundation and security IP. More: bit.ly/4hZRhL6

#ICYMI Synopsys' next-gen ZeBu (code-named 'Artemis') is on the 2027 roadmap and destined to deliver larger capacity, higher performance and unmatched reliability. Learn more: bit.ly/3WAtuKE

Bigger teams. Better tools. More compute. That used to be the advantage.    Thomas Andersen explains why knowledge is the new advantage in Part 3 of his Agentic AI in Chip Design series: bit.ly/4imO4qn

Lots to talk about when it comes to the future of semiconductor engineering. Synopsys President & CEO @SassineGhazi joined @Chip_Insider at #SEMICONWest 2026 for an insightful conversation on AI, autonomous design, physical AI and more. It was a great few days connecting with the semiconductor community.

The industry needs more skilled chip designers, and hands-on experience is how you get there. Our 'Chip Design to Tapeout' pilot with @GlobalFoundries gave students at nearly 40 universities a path from concept to silicon. Here's how Synopsys Cloud made it work: bit.ly/4jjtzfp

🤝 Collaboration is key to customer success and we're proud to be doing just that with @Intel_Foundry.